Design Linked Incentive (DLI) Scheme – Overview

Implemented by: Ministry of Electronics and Information Technology (MeitY) under the Semicon India Programme.

Objective:

  • Create a globally competitive, self‑reliant fabless semiconductor design ecosystem.
  • Promote indigenous design, IP ownership and deployment in electronic products.

Key Facts & Data Points

  • Financial Incentives:
  • Product Design Linked Incentive (PDLI): Reimbursement up to 50% of eligible expenditure, capped at ₹15 crore per application.
  • Deployment Linked Incentive (DLI): 4–6% of net sales turnover for five years, capped at ₹30 crore per application, subject to minimum sales and successful product deployment.
  • Eligibility:
  • Start‑ups (as per DPIIT Notification, 2019)
  • MSMEs (as per MSME Notification, 2020)
  • Domestic companies owned by resident Indian citizens in line with FDI Policy Circular, 2017.
  • Scope of Support:
  • Integrated Circuits (ICs), Chipsets, Systems‑on‑Chip (SoCs), systems, and IP cores.
  • Design Infrastructure:
  • Provided through ChipIN Centre (C‑DAC) – access to National EDA Tool Grid, IP core repositories, MPW prototyping, post‑silicon validation.
  • Achievements (as of Jan 2026):
  • 24 chip‑design projects sanctioned (video surveillance, drone detection, energy meters, microprocessors, satellite communications, IoT SoCs).
  • ChipIN Centre supports ~1 lakh engineers & students across ~400 organisations.
  • Semicon India Programme (SIM) Outlay: ₹76,000 crore for semiconductor & display manufacturing plus design.
  • Related Capacity‑Building Initiatives:
  • Chips to Startup (C2S) Programme – target of ~85,000 industry‑ready professionals.
  • Microprocessor Development Programme – indigenous microprocessors VEGA, SHAKTI, AJIT.

Background & Context

  • Global Supply‑Chain Vulnerabilities: Recent disruptions highlighted the strategic importance of semiconductor design.
  • Value Chain Insight: Design & IP contribute >50% of a chip’s value, account for 20–50% of Bill of Materials, and drive 30–35% of global semiconductor sales.
  • Strategic Position of Fabless Firms: They sit at the core of innovation, performance, security and long‑term competitiveness.
  • India’s Gap: Lack of indigenous design forces dependence on imported core technologies, even when fabs are domestic.

Significance for India / Governance / Policy

  • Technology Self‑Reliance: Aligns with ‘Atmanirbhar Bharat’ and Make in India objectives.
  • Economic Impact: Higher value‑addition, export potential, and job creation in high‑skill sectors.
  • Security: Reduces reliance on foreign IP, enhancing cyber‑security and defence capabilities.
  • Policy Integration: Linked with Semicon India Programme, C‑DAC, C2S, and Microprocessor Development Programme, creating a holistic ecosystem.

Related Constitutional / Legal Provisions

  • Article 246 – Union List entry on ‘Electronics and Information Technology’ empowers the Centre to legislate and implement schemes like DLI.
  • FDI Policy (2017 Circular) – Governs foreign investment norms for eligible domestic companies.
  • DPIIT & MSME Notifications – Define eligibility criteria for start‑ups and MSMEs.

References

  • Press Information Bureau (PIB) releases, Jan 2026.
  • Ministry of Electronics & Information Technology (MeitY) documents.
  • C‑DAC ChipIN Centre publications.